Pioneering a New Era of Liquid-cooled "Copper" Heat Dissipation
Leveraging its independently developed continuous casting equipment, the company has established a strong presence in the high-purity oxygen-free copper sector
and provides system solutions featuring superior liquid-cooling technology for global AI computing centers and power batteries.
Business Introduction
Designed for liquid cooling in AI server racks, it integrates conductive heat exchange and is compatible with high-performance servers to address heat dissipation challenges caused by high heat flux.
- Focusing on the power semiconductor and liquid cooling sectors, our new energy copper-based materials business centers on core products such as DCB copper strips and integrally formed through-hole copper busbars. We prioritize fundamental materials and core technologies, achieving independent production of key equipment (such as continuous casting furnaces) and the digital-intelligent transformation of production lines. Leveraging a proprietary, short-process, integrated forming technology for high-purity copper—featuring >99.995% purity and <3ppm oxygen content, alongside excellent electrical and thermal conductivity—we provide highly reliable copper material solutions for new energy applications and AI computing equipment.
- DCB Copper Tape Is Suitable for Power Semiconductor Modules, Ensuring the Stable Operation of Automotive and Power Electronics Devices
- The through-hole copper busbar is integrally molded with no welds, combining electrical conductivity with liquid cooling heat exchange, and is designed for AI data center cabinets.
- Serving multiple cutting-edge sectors, including new energy vehicles, power semiconductors, and AI liquid-cooled computing
Related products
Liquid-cooled plate
Ultra-high-purity oxygen-free copper
is not susceptible to hydrogen embrittlement and offers excellent weldability.
| Key Performance | Key Values |
| Copper Content | ≥99.995% |
| Oxygen content | ≤5 ppm |
| Electrical conductivity | ≥101% IACS |
| Thermal conductivity | ≥430 W/(m·K) |
Liquid-cooled Profiles
Continuous Casting, Low Cost
| Key Performance | Key Values |
| Copper Content | ≥99.995% |
| Oxygen content | ≤5 ppm |
| Electrical conductivity | ≥101% IACS |
| Thermal conductivity | ≥430 W/(m·K) |
Custom-shaped Copper Busbars
No bubbling at high temperatures
Customizable product design
| Key Performance | Key Values |
| Copper Content | ≥99.995% |
| Oxygen content | ≤5 ppm |
| Electrical conductivity | ≥101% IACS |
| Thermal conductivity | ≥430 W/(m·K) |
Through-hole Copper Busbar
Manufactured using integrated molding technology, with a copper purity of ≥99.995%, oxygen content of ≤3 ppm, and thermal conductivity of ≥420 W/(m·K), this product is specifically designed for liquid cooling applications in AI data center cabinets.
- Key Features and Benefits:
- High-purity, low-oxygen: Cu ≥ 99.995%, O ≤ 3 ppm; resistant to hydrogen embrittlement; uniform microstructure; stable long-term performance.
- Excellent Thermal Conductivity: Thermal conductivity ≥ 420 W/(m·K), rapidly dissipates high heat flux from AI servers and reduces chip junction temperature.
- One-piece molding technology: One-piece molding eliminates weld seams, removes thermal resistance and the risk of leaks, ensures a stable inner wall of the runner, and reduces the need for machining.
Core Advantages
Oxygen Content Control
Equipment Self-Reliance: In-house Development of Upward-Drawing and Horizontal Continuous Casting Furnaces
Centuray Technology is not merely a processor, but also an equipment supplier. Through our independently designed continuous casting equipment, we achieve zero oxygen contact right from the molten copper smelting stage, ensuring that the material possesses the very best properties for heat dissipation from the moment it is created.
Experts in the Application of Low-oxygen Copper
We have conducted in-depth research into the properties of high-purity copper and chromium-zirconium copper alloys. In complex liquid-cooled tube bending and welding processes, we have effectively resolved the issues of hydrogen embrittlement and stress cracking that commonly occur in standard copper materials.
Driving Industry Value
Through our end-to-end, independently controlled capabilities, we deliver significant cost advantages, agile delivery cycles and a high degree of customisation to our clients.
